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Specialist in Manafacturing, Test and Inspection Solutions

Test Services

FEA Analysis

ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"