At Elite Interfaces, we have experienced testers to test all equipment

Contract Testing

Does your company have insufficient ICT capability on your site or are your volumes are too low to justify the purchase of an ICT system? Let Elite Interfaces take the worry from you and provide a solution. Contract Testing of any batch size. Contact us for your board test needs.

Consultancy

Elite Interfaces have a wealth of experience across test disciplines and technologies in the Electronics Manufacturing Industry
- Design for Test
- Design for Manufacture
- Design for Automation
And many more

Training

Elite offer a number of different courses related to ICT Development and support and can also design/tailor a course around your needs

FEA Analysis

ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"

FEA Analysis

Strain Gauge Testing Strain Testing of PCBs inside a Test Fixture If required as part of a fixture build, Elite can offer two methods of analysing the strain experienced by the PCB inside a Test Fixture. Predictive Stress Analysis ICT Fixturing can employ thousands of probes to contact test points on both sides of a PCB, and often it is not possible to completely balance the forces to offset strain on the UUT. It is however, possible to predict just how much strain there could be in a particular location on the board using Finite Element Analysis (FEA) modelling techniques. Get this part of the process wrong, and you could end up with; cracked components, PCB delamination, lifted component legs, or even broken tracks. Elite employ a 'state of the art' FEA modelling tool taking into account; probe position and force, pushrod and board stop position, and board thickness to simulate the strain on a PCB. Strain limits are checked in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"

As an extension of the predictive analysis previously mentioned, it becomes possible to measure the PCB's strain during the test actuation process and form an objective view as to whether any corrective actions need to take place. Small resistive sensors called stacked rosettes are fixed to the PCB in strategic locations, either predicted by the earlier FEA process or in close proximity to strain sensitive components. If required the customer can be provided with reports that are produced in accordance with the test limits defined on Appendix A of the IPC/JEDEC-9704 standard entitled, "Printed Wiring Board Strain Gauge Test Guideline"

Specialist in Manafacturing, Test and Inspection Solutions

Test Services

Contract Testing

Consultancy

Training

FEA Analysis

FEA Analysis